Excelsys Sign Distribution Agreement with Luso Electronics
Excelsys Technologies, leaders in high efficiency power supply design, announces the addition of Luso Electronics to our distributor network. Luso will distribute power solutions from Excelsys Technologies to customers in a variety of specialist markets including Military, Industrial, Medical and Communications throughout the UK.
“At Excelsys we are delighted to have Luso join our European Distribution Partner program. Luso have a fantastic reputation in the UK market built on technical expertise and operational excellence. Luso will support all Excelsys platforms including Xgen, UltiMod, Xsolo and our recently launched CoolX Series, the world’s only convection cooled modular platform. The expert Sales and Applications Engineering teams at Excelsys will work closely together with Luso to define and deliver best-in-class solutions to our customers in terms of performance, flexibility and reliability.” Conor Duffy, European Sales Manager, Excelsys Technologies.
The CoolX600 Series is the latest revolutionary, convection-cooled modular power supply from Excelsys Technologies and delivers an incredible 600W without fan assisted cooling from a very compact 8.5 x 4.5 x 1U package. The only fanless modular power supply on the market, the CoolX600 offers system designers best in class performance for efficiency and reliability in addition to the most comprehensive feature set and specifications available. An industry leading 5 year warranty ensures quality, reliability and the lowest total cost of ownership.
Other products in the Excelsys range include the UltiMod and Xgen user configurable modular power supplies suitable of applications including, industrial, medical, laser, communications, IT, wafer fabrication, optical inspection, wire bonding, and automated test equipmentOther products in the Excelsys range include the UltiMod and Xgen user configurable modular power supplies suitable of applications including, industrial, medical, laser, communications, IT, wafer fabrication, optical inspection, wire bonding, and automated test equipment