Excelsys to exhibit high reliability power supplies at Laser World of Photonics exhibition
Laser World of Photonics – Munich – 26th June to the 29th June 2017
Visit Excelsys in Hall B3 Booth 526
Industry leading 5 year warranty on Excelsys power supplies
Excelsys Technologies, the leading manufacturer of hi-reliability modular user configurable power supplies, is exhibiting at the Laser World of Photonics exhibition being held in Munich from June 26th to the 29th.
Laser World of Photonics show showcases products including electro-optics and acousto-optics, photoelectric tubes, opto-electronic devices, optical systems and software for laser and optic systems. In addition manufacturers and distributors of electronic systems and electrical products will be exhibiting.
Excelsys have a proven track record of supplying their UltiMod and Xgen 200 – 1340 watt output user configurable modular power supplies for applications including medical, laser and optical inspection systems. Our recently introduced and revolutionary CoolX series of 600 watt output power supplies is being welcomed in these markets as it requires no cooling fan, eliminating acoustic noise, eliminating vibration and increasing reliability.
“We are a key supplier of high reliability power solutions to clinical and cosmetic laser manufacturers as well as industrial and scientific laser and optical systems builders” comments Dermot Flynn, Sales Director of Excelsys Technologies. “Customers like the 1U size, greater than 90% efficiency and the extensive control features that we include as standard. Our product flexibility provides customers with multiple outputs, allowing them to drive the various electronics in their laser systems, all from one power supply. These standard, off the shelf, power supplies reduce system design time, NRE (Non-Recurring Engineering) charges, and simplify system compliance”.
Excelsys CoolX, UltiMod and Xgen user configurable modular power supplies are suitable for applications including, industrial, medical, laser, communications, IT, wafer fabrication, optical inspection, wire bonding, and automated test equipment.